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Technical Capabilities


Parameter

Value

Comment

Number of layers

20-36

Depend on hole size

Min. conductor outer layer

75 µm

Min. conductor inner layer

50 µm

Min. mechanical drilled hole

150 µm

Board thickness< 2,40 mm

Min. laser drilled hole

25 µm

Min. laser blind via

50 µm

Max. aspect ratio - plated through hole

             1:12

Max. aspect ratio - blind via hole

             1:1

Distance hole - conductor

175 µm

Rigid board

Distance hole - conductor

225 µm

Flexible board

Controled impedance

+/- 5 %

Min. board thickness

25 µm

Not HAL

Max. board thickness

10,0 mm

Depend on hole size

Max. board thickness

600x1350mm

Depend on board type

Copper thickness

9 – 400 µm

 

Laminate

FR4
FR 4 high Tg
Rogers
Tatonics
Arlon
Polyimid

Solder mask

Green
White
Red
Dark blue
Black

Legend

White
Yellow
Black

Surface treatment

HAL
Chemical tin
Chemical silver
Chemical Nickel/Gold



Peelable mask

Blue





Carbon ink

Remember: Drill diameter = Hole diameter + 50 µm

If you are going to design a board with many min. parameter value, contact Civa. Otherwise the board can be difficult to produce and expensive.
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