|
Parameter |
Value |
Comment |
|
Number of layers |
0-78 |
Depend on hole size |
|
Min. conductor outer layer |
75 µm |
|
|
Min. conductor inner layer |
50 µm |
|
|
Min. mechanical drilled hole |
150 µm |
Board thickness< 2,40 mm |
|
Min. laser drilled hole |
25 µm |
|
|
Min. laser blind via |
50 µm |
|
|
Max. aspect ratio - plated through hole |
1:12 |
Depend on board thickness and hole size
|
|
Max. aspect ratio - blind via hole |
1:1 |
|
|
Distance hole - conductor |
175 µm |
Rigid board |
|
Distance hole - conductor |
225 µm |
Flexible board |
|
Controlled impedance |
+/- 5 % |
|
|
Min. board thickness |
25 µm |
Not LF-HAL |
|
Max. board thickness |
10,0 mm |
Depend on hole size |
|
Max. board size |
600x1350mm |
Depend on board type |
|
Copper thickness |
9 – 400 µm |
|
|
|
|
|
|
|
|
|
|
Laminate
FR4
FR4 high Tg
Polyimid
CEM-1
CEM-3
Metal core (IMS)
from Arlon, Isola, ITEQ, Panasonic, Rogers, Shengyi/SYTECH, Taconic and more.
Solder mask
Green
White
Red
Dark blue
Black
Legend
White
Blue
Yellow
Black |
Surface treatment
Leadfree HAL
ENIG (Chemical Nickel/Gold)
ENEPIG
Electroplated Gold
Chemical tin
Chemical silver
OSP
Peelable mask
Blue
Carbon ink Black |
|
Remember: Drill diameter = Hole diameter + 50 µm |
|
If you are going to design a board with many min. parameter value, contact Civa. Otherwise the board can be difficult to produce and expensive.