Civa AS
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Parameter

Value

Comment

Number of layers

0-78

Depend on hole size

Min. conductor outer layer

75 µm

Min. conductor inner layer

50 µm

Min. mechanical drilled hole

150 µm

Board thickness< 2,40 mm

Min. laser drilled hole

25 µm

Min. laser blind via

50 µm

Max. aspect ratio - plated through hole

1:12

Depend on board thickness and hole size

Max. aspect ratio - blind via hole

1:1

Distance hole - conductor

175 µm

Rigid board

Distance hole - conductor

225 µm

Flexible board

Controlled impedance

+/- 5 %

Min. board thickness

25 µm

Not LF-HAL

Max. board thickness

10,0 mm

Depend on hole size

Max. board size

600x1350mm

Depend on board type

Copper thickness

9 – 400 µm

 

Laminate

FR4
FR4 high Tg
Polyimid
CEM-1
CEM-3
Metal core (IMS)
from Arlon, Isola, ITEQ, Panasonic, Rogers,  Shengyi/SYTECH, Taconic and more.  

Solder mask

Green
White
Red
Dark blue
Black

Legend

White
Blue
Yellow
Black

Surface treatment

Leadfree HAL
ENIG (Chemical Nickel/Gold)
ENEPIG
Electroplated Gold
Chemical tin
Chemical silver
OSP

Peelable mask

Blue




Carbon ink

Black

Remember: Drill diameter = Hole diameter + 50 µm

If you are going to design a board with many min. parameter value, contact Civa. Otherwise the board can be difficult to produce and expensive.