The table show use and storage of different surface finishing.
|
HAL |
Tin |
Chemical gold |
Chemical gold |
Galv. gold |
Galv. gold |
Chemical Silver |
OSP |
|
|
|
Flash gold |
Soft gold |
Soft gold |
Hard gold |
|
|
Thickness |
1-40 µm |
1µm |
0,07µm Au |
> 0,4µm Au |
> 0,4 µm Au |
1,3 µm Au |
> 0,25 µm |
> 0,2 µm |
|
|
|
4µm Ni |
4µm Ni |
4µm Ni |
4µm Ni |
|
|
Storage |
12 month |
6 month. |
12 month |
> 12 month |
> 12 month |
> 12 month |
6 month |
3 month |
Pressfit |
Yes |
* |
No |
No |
No |
No |
* |
No |
Pressure connector |
Voltage dependent |
No |
Yes |
Yes |
Yes |
Yes |
No |
No |
Sliding connector Male/Female connector |
No |
No |
No |
No |
No |
Yes |
No |
No |
Al bonding |
No |
No |
Yes |
No |
No |
No |
No |
No |
Au bonding |
No |
No |
No |
Yes |
Yes |
No |
No |
No |
High frequency performance |
Moderate |
Moderate |
Poor |
Poor |
Poor |
Poor |
Excellent |
Excellent |
*
If pressfit can be used with chemical tin or chemical silver depend on which process the PCB manufacture is using. Some chemical tin and silver process deposite a organo metallic compound. Civa has not received any documentation that pressfit can be used with this types of surface treatment