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Design Rules

 

Betegnelse

Parameter

Standard

Min

A,B,C

Plated through hole

Aspect rate

1:8

1:12

 

 

Finished hole

250 µm

150 µm

 

 

Annularring

150 µm

100 µm

 

 

Solder pad

600 µm

450 µm

D

Mechanical drilled blind via

Aspect rate

1 : 1

1: 1

 

(After pressing)

Finished hole

250 µm

100 µm

 

 

Annularring

150 µm

150 µm

 

 

Solder pad

600 µm

450 µm

E

Laser drilled blind via

Aspect rate

1 : 1

1: 1

 

 

Finished hole

75 µm

50 µm

 

 

Annularring

75 µm

75 µm

 

 

Solder pad

225µm

200 µm

F

Conductor, outer layer

Width

125 µm

75 µm

 

 

Isolation

125 µm

75 µm

G

Conductor, inner layer

Width

125 µm

70 µm

 

 

Isolation

125 µm

70 µm

H

Conductor/Solder pad – Contour

Space

400 µm

200 µm

I

Conductor/Solder pad - Hole

Space

275 µm

225 µm

J

Solder mask– Solder pad

Space

75 µm

50 µm

 

Solder mask

Width

200 µm

100 µm

 

Unplated hole

Annularring

400 µm

400 µm

 

Legend – Solder mask

Space

150 µm

100 µm

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