Technical Capabilities

Parameter	Value		Comment
Number of layers	0-78		Depend on hole size
Min. conductor outer layer	75 µm
Min. conductor inner layer	50 µm
Min. mechanical drilled hole	150 µm		Board thickness< 2,40 mm
Min. laser drilled hole	25 µm
Min. laser blind via	50 µm
Max. aspect ratio - plated through hole	1:12		Depend on board thickness and hole size
Max. aspect ratio - blind via hole	1:1
Distance hole - conductor	175 µm		Rigid board
Distance hole - conductor	225 µm		Flexible board
Controlled impedance	+/- 5 %
Min. board thickness	25 µm		Not LF-HAL
Max. board thickness	10,0 mm		Depend on hole size
Max. board size	600x1350mm		Depend on board type
Copper thickness	9 – 400 µm


Laminate FR4 FR4 high Tg Polyimid CEM-1 CEM-3 Metal core (IMS) from Arlon, Isola, ITEQ, Panasonic, Rogers, Shengyi/SYTECH, Taconic and more. Solder mask Green White Red Dark blue Black Legend White Blue Yellow Black		Surface treatment Leadfree HAL ENIG (Chemical Nickel/Gold) ENEPIG Electroplated Gold Chemical tin Chemical silver OSP Peelable mask Blue Carbon ink Black
Remember: Drill diameter = Hole diameter + 50 µm

If you are going to design a board with many min. parameter value, contact Civa. Otherwise the board can be difficult to produce and expensive.

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